绝缘涂料

内容简介

详细说明

ChipCoat
半导体IC封装用的高纯度绝缘材料.
(特点): 耐湿性佳, 耐热循环性佳,低应力性佳.

用途:

Flip Chip- Underfill Material
Wire Bondong- Glob Top Material
Tape carrier package (TCP)- Chip Coating Material

规格:

Underfill: 10g/10cc, 30g/30cc syringe
Glob-top: 50g/30cc syringe
TCP: 75g/55cc syringe

产品联络人
陈世凯 Harry

HIGH TECH & INNOVATIVE MATERIAL BUSINESS UNIT

10F, Building 5, No.2388 ChenHang Road, Minhang District, Shanghai, China (Zip: 201114)
TEL:86-21-6422-0458 ext.289
e-mail:harry.chen@topco-global.com


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